Advantages
2019-1-15 · [Max grinding current , normal feed , A ] Life time [ Wafers wheel ] Roughness [ Ra, nm ] Bond type Mesh size Bond type Mesh size X40, after rough grinding EHWA until 90㎛ left X40, after fine grinding until 50㎛ left Wheel type : #600, RSL bond Wheel type : #3000, SWDL bond EHWA DIAMOD SEMICONDUCTOR DISPLAY SOLAR & LED EHWA DIAMOND IND ...
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